Characteristics of plasma-resistant Y2O3 powder coatings produced using different spraying processes

To reduce the generation of contaminants during semiconductor manufacturing, it is essential to apply coatings that prevent erosion of the internal surfaces and components of the chamber, and much research is being conducted in this regard. In this study, we investigated the plasma resistance and mechanical properties of yttrium oxide (Y 2 O 3 ) coatings produced via atmospheric plasma spraying (APS), vacuum plasma spraying (VPS), suspension plasma spraying (SPS), and suspension vacuum plasma spraying (SVPS). To this end, fine Y 2 O 3 powder was utilized, and the process parameters were optimized for each spraying method. Coatings were characterized in terms of their microstructure, porosity, hardness, surface roughness, and plasma resistance. Our results indicate that SVPS produces Y 2 O 3 coatings with significantly superior density, minimal porosity, and enhanced mechanical properties compared to those produced using traditional APS, VPS, and SPS. The SVPS coatings exhibited the highest hardness and plasma resistance, making them suitable for semiconductor manufacturing environments wherein durability and minimal contamination are critical.