Microfluidic-enabled three-dimensional stretchable thermoelectrics

Stretchable electronics hold promise but remain limited to low‑power use due to poor heat dissipation. We present a three-dimensional (3D) integration strategy combining elastomeric material modification, 3D printing, and laser etching to fabricate stretchable thermoelectric devices (TEDs) with enhanced refrigeration capabilities. The device features a 3D architecture integrating embedded microfluidics with multilayer thermoelectric networks, providing improved heat exchange capacity suitable for high thermal design power (TDP) requirements. The device achieves ~10 °C environmental and 11 °C on-skin temperature reduction with precise control. Furthermore, by integrating a temperature sensor and control circuit with the 3D TED, a wearable closed-loop system is developed. Benefiting from the improved device performance and advanced control algorithms, this system enables accurate and rapid regulation of skin temperature, demonstrating potential applications in virtual temperature and pain sensation. The integration method proposed here may offer a generalizable approach for advancing high-power stretchable electronics, thereby broadening their range of applications.

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Publication Details

Journal
npj Flexible Electronics
Published
2025-06-06
DOI
https://doi.org/10.1038/s41528-025-00429-0
Citations
2
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
1.35

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article

Microfluidic-enabled three-dimensional stretchable thermoelectrics

Rui Zhou, Liming Peng, Binbin Jiang, Dongliang Fan et al.
2 citations
npj Flexible Electronics
Advanced Sensor and Energy Harvesting Materials
1.35
article

Microfluidic-enabled three-dimensional stretchable thermoelectrics

Rui Zhou, Liming Peng, Binbin Jiang, Dongliang Fan, Dongfeng Xue, Taisong Pan, Junjie Ji, Zhenlong Huang, Linlong Liang, Guang Yao, Yan Jiang, Tao Chen, Min Gao, Yizhuo Wang, Jia Zhu, Longpeng Yang, Hongwei Xie, Yuan Lin
article en
2 citations

Abstract

Stretchable electronics hold promise but remain limited to low‑power use due to poor heat dissipation. We present a three-dimensional (3D) integration strategy combining elastomeric material modification, 3D printing, and laser etching to fabricate stretchable thermoelectric devices (TEDs) with enhanced refrigeration capabilities. The device features a 3D architecture integrating embedded microfluidics with multilayer thermoelectric networks, providing improved heat exchange capacity suitable for high thermal design power (TDP) requirements. The device achieves ~10 °C environmental and 11 °C on-skin temperature reduction with precise control. Furthermore, by integrating a temperature sensor and control circuit with the 3D TED, a wearable closed-loop system is developed. Benefiting from the improved device performance and advanced control algorithms, this system enables accurate and rapid regulation of skin temperature, demonstrating potential applications in virtual temperature and pain sensation. The integration method proposed here may offer a generalizable approach for advancing high-power stretchable electronics, thereby broadening their range of applications.

npj Flexible ElectronicsVol. 9(1)
University of Electronic Science and Technology of China (CN), National Engineering Research Center of Electromagnetic Radiation Control Materials (CN)
National Natural Science Foundation of China, Basic and Applied Basic Research Foundation of Guangdong Province
Openalex Percentile: Top 20%
Advanced Sensor and Energy Harvesting Materials
1.35
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