Validation of the solder paste imprinting process: KOKI S3X58-M650-7 based on an experiment conducted with the use of the DoE methodology

This paper presents an analysis of the influence of selected parameters of the wire bonding process on the occurrence of lift-off defects using the Design of Experiments (DOE) methodology. A structured experimental plan was used to evaluate the effect of key process factors, including ultrasonic power, bonding time, and bond force. Statistical analysis was performed to identify significant variables and optimize the process parameters. The results indicate specific interactions between variables that contribute to the minimization of lift-off defects, thus enhancing bond quality and production yield.