Stress analysis of C-TSV interposer with embedded cooling

Abstract TSV interposers, as key structures driving the development of microsystem packaging towards integration, modularization, and miniaturization, face severe challenges in signal transmission, thermal management, and reliability due to the continuously increasing integration density of high-power devices. Therefore, this paper proposes a design scheme for an embedded cooling C-TSV interposer. An in-depth analysis of the stress distribution within the embedded cooling C-TSV interposer is conducted by establishing precise fluid thermal models and plane stress models. The research results show that this interposer significantly enhances heat dissipation efficiency through the embedded liquid-cooled cavity, effectively mitigating the thermal stress issues arising from high thermal loads. This innovative design not only addresses the heat management challenges posed by the integration of high-power devices but also significantly improves the overall reliability and stability of the interposer. It provides new ideas and methods for the development of microsystem packaging technology.