Research on high-reliability assembly and soldering process for low-CTE small-size PBGA

Abstract In this paper, the factors affecting the reliability of small-size PBGA with low thermal expansion coefficient are determined by theoretical and simulation analysis. The simulation results are verified by reliability test, dye penetration, metallographic section, and electron microscope scanning analysis, revealing that the height and diameter of solder joints are reliable with low CTE small size PBGA. The high-reliability welding process method of this kind of device is obtained, which is of great significance for the quality assurance of aviation and aerospace electronic products.