Reliability study of POP stacked packages under drop impact loading

Abstract In the context of the ongoing development of multifunctional, portable, and thin and light portable electronic products, the study of the mechanical behavior of microelectronic package solder joints under drop impact loads has become a significant area of research in product reliability. This paper analyzes the displacement and stress of POP (Package-on-Package) package SAC305 (Sn0.3Ag0.5Cu) solder joints. The finite element simulation software was utilized to analyze the solder joints under drop impact load. The Input-G method was employed to apply the drop impact acceleration. The analysis revealed that the bottom corner solder joint 3 of the U2A component is the most hazardous solder joint in the package. The stress level of this solder joint determines the impact of the POP package during the drop impact process. A further key consideration when optimizing the design is the potential damage to the POP package during the drop shock process.