Fatigue life prediction of SM64C under thermal cyclic loading

Abstract Factors such as optimal pad design dimensions, solder volume, and component mounting standoff height have a direct impact on solder joint morphology, which in turn affects reliability. This study focuses on the SM64C package device, which exhibits a high failure rate under thermal cycling loads, to determine the solder joint morphology under various design and production parameters. A fatigue life prediction model under thermal cycling was established, and the predicted lifespans of different solder joint morphologies were simulated and compared. The findings indicate that as the solder joint morphology becomes more filled, the fatigue life of such device solder joints tends to decrease. This method can be applied during the printed circuit board design and production process parameter design stages. By modeling and calculating for different temperature environments, highly reliable product design parameters can be obtained.