Scaling EMIB—A Comprehensive Architecture Portfolio for Localized Interconnects

Embedded multi-die interconnect bridge (EMIB) is a significant packaging technology platform currently in high-volume production, offering high-density, and localized in-package interconnects for the heterogeneous integration (HI) of chips. We describe initial success in expanding the EMIB technology envelope along four vectors i.e., pitch and wire scaling, addition of through silicon vias (TSVs) in the bridge, demonstration of an open cavity architecture, and the integration of active bridge die. All four technology vectors result in significant improvements in the HI envelope and will lead to significantly improved HI products.