Micromachined Piezoresistive Pressure Sensor With High Robustness
Micromachined piezoresistive pressure sensors are extensively utilized in various industrial applications. However, they often suffer from challenges such as temperature-induced resistance fluctuations and leakage currents, which can compromise measurement accuracy and long-term stability. This paper introduces a novel sensor design aimed at improving temperature stability and minimizing leakage currents. The proposed design incorporates a platinum (Pt) resistor on the chip surface for real-time temperature compensation and an isolation ring to effectively reduce leakage currents. Fabricated using a standard micro-electro-mechanical systems (MEMS) process, the pressure sensor was subjected to experimental evaluation. The results reveal that the fabricated sensor exhibits exceptional durability, stability, and resilience under a variety of environmental stresses, including temperature fluctuations, mechanical shocks, vibrations, and humidity exposure. These characteristics make the sensor a robust solution for demanding industrial applications that require high precision and long-term stability. Based on the experimental data, the sensor is expected to perform robustly in diverse conditions, with an operational lifespan exceeding 10 years.
Authors
- Jianwei Guo (ORCID: https://orcid.org/0000-0003-2007-4798)
- Yizhou Ye (ORCID: https://orcid.org/0000-0003-2906-9426)
- Xiaodong Huang (ORCID: https://orcid.org/0000-0003-0303-7821)
- C Chen (ORCID: https://orcid.org/0009-0003-9435-0596)
- Tongqing Liu
- Zhiyi Lan (ORCID: https://orcid.org/0000-0001-5519-2474)
- Weiping Li (ORCID: https://orcid.org/0000-0002-5882-8527)
- Zechun Dou
- Lei Gao (ORCID: https://orcid.org/0000-0003-2164-0480)
Institutions
- Shenyang Aerospace University (CN)
- Chongqing University (CN)
- WuXi AppTec (China) (CN)
- Nanjing University of the Arts (CN)
- Southeast University (CN)
- Wuxi Institute of Technology (CN)
Publication Details
- Journal
- IEEE Sensors Journal
- Published
- 2025-06-06
- DOI
- https://doi.org/10.1109/jsen.2025.3575533
- Citations
- 2
- Primary Topic
- Advanced MEMS and NEMS Technologies
- Type
- article
- Field-Weighted Citation Impact
- 1.46
Funders
- National Natural Science Foundation of China