<em>In Vitro</em> Evaluation of The Effects Of Er,Cr:YSGG and Diode Lasers Used on Titanium Cylinder

Peri-implant diseases are significant issues associated with dental implants. The aim of this study was to evaluate the surface roughness and temperature changes when diode and Erbium, Chromium-doped Yttrium-Scandium-Gallium-Garnet (Er,Cr:YSGG) lasers are applied on titanium cylinders in the treatment of non-surgical peri-implant diseases.A total of 13 groups, including the control group, were formed with 940 nm diode (0.8 W-1.3 W-1.8 W) and Er,Cr:YSGG (1.5 W-2.5 W-3.5 W) lasers in 6 different power modes, 20s/W and 40 s/W, and eight titanium cylinders were treated in each group. During the process, the initial and final temperatures were recorded with a thermocouple placed in the apical slot of the cylinder. After the application, the roughness (Ra) of all disks was measured by a profilometer. The surfaces were scanned by scanning electron microscope (SEM) and atomic force microscope (AFM) for two- and three-dimensional surface examination.When the temperature changes of the titanium cylinders during irradiation were evaluated, the cylinders irradiated with a diode laser for 40 s were significantly higher than those irradiated for 20 s. In the Er,Cr:YSGG treated cylinders, the temperature decreased in some samples and increased minimally in some samples. Profilometer values (Ra) were not statistically significant in terms of roughness for all groups. However, SEM images showed melting and an increase in the number of micropores on the treated surfaces.With the limitations of this in vitro study, the application of the Er,Cr:YSGG, and the diode can be regarded as a safe approach for the management of peri-implantitis, particularly in terms of thermal safety. While the surface roughness remains unchanged, the use of these lasers resulted in melting changes and micropores on the Ti cylinder topography. To determine how these laser settings affect bacterial decrease and osseointegration, additional research is needed.