Monolithically Integrated Microring Transmitter and Receiver for High-Density 3D Co-Packaged Optics
We report silicon microring transmitter and receiver with monolithically integrated driver and analog front end at up to 64Gbps NRZ. The total die area of the circuits is 0.006 mm 2 , 10x smaller than prior reports.
Authors
- Carlos I. Dorta-Quiñones (ORCID: https://orcid.org/0000-0001-6580-8113)
- Darius Bunandar (ORCID: https://orcid.org/0000-0002-8218-5656)
- Alexander Sludds (ORCID: https://orcid.org/0000-0002-7443-1378)
- Reza Baghdadi
- Joyce K. S. Poon (ORCID: https://orcid.org/0000-0002-3691-4344)
- Pietro Ciccarella (ORCID: https://orcid.org/0000-0001-6506-1929)
- Shashank Gupta (ORCID: https://orcid.org/0000-0001-5100-3496)
- Nicholas C. Harris (ORCID: https://orcid.org/0000-0003-3009-563X)
- Bryce Gardiner
Institutions
- Lightmatter (United States) (US)
Publication Details
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1364/ofc.2025.tu3j.6
- Citations
- 1
- Primary Topic
- Photonic and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.73