Predicting Film Thickness and Properties in CESL Process Based on CGAN

Contact etch stop layer (CESL) process plays a pivotal role in semiconductor manufacturing, where accurate predicting the THK and RI of silicon nitride film in CESL process is crucial. This paper introduces a Conditional Generative Adversarial Network (CGAN)-based prediction model, which simultaneously predicts film thickness and refractive index by CESL process recipes. By incorporating adversarial training, the model achieves superior accuracy compared to traditional methods such as Support Vector Regression (SVR) and XGBoost. This advancement allows for improved process optimization, reduced dependence on physical experiments, and better production quality control.

Authors

Institutions

Publication Details

Published
2025-03-24
DOI
https://doi.org/10.1109/cstic64481.2025.11017803
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Predicting Film Thickness and Properties in CESL Process Based on CGAN

Wenzhang Fang, Jinxu Liu, Yifan Jin, Yitao Ma et al.
4 links
Copper Interconnects and Reliability
article

Predicting Film Thickness and Properties in CESL Process Based on CGAN

Wenzhang Fang, Jinxu Liu, Yifan Jin, Yitao Ma, Yan Zhang, Yiyu Cheng, Liangyao Deng
article en

Abstract

Contact etch stop layer (CESL) process plays a pivotal role in semiconductor manufacturing, where accurate predicting the THK and RI of silicon nitride film in CESL process is crucial. This paper introduces a Conditional Generative Adversarial Network (CGAN)-based prediction model, which simultaneously predicts film thickness and refractive index by CESL process recipes. By incorporating adversarial training, the model achieves superior accuracy compared to traditional methods such as Support Vector Regression (SVR) and XGBoost. This advancement allows for improved process optimization, reduced dependence on physical experiments, and better production quality control.

Zhejiang University (CN)
Openalex Percentile: Top 93%
Copper Interconnects and Reliability
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.