Effect of Green Surfactant ADS on Properties of Copper CMP Slurry
In copper (Cu) film chemical mechanical polishing (CMP) of integrated circuits, the surfactant can disperse the abrasive and enhance the stability of the slurry to achieve a more consistent material removal rate (MRR) and low surface roughness. In this paper, the roles of anionic surfactant ammonium dodecyl sulfate (ADS) and fatty alcohol polyether (JFCE) on the MRR, surface roughness and slurry stability of copper were studied. Compared with the JFCE, the same concentration of anionic surfactant ADS can promote the dispersion of SiO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> abrasive particles more rapidly and form a stable suspension.
Authors
- Bin Hu (ORCID: https://orcid.org/0000-0003-2171-2202)
- Zheng Wu (ORCID: https://orcid.org/0000-0002-2563-3387)
- Ni Zhan
- Xinhuan Niu
- Jiakai Zhou (ORCID: https://orcid.org/0000-0001-7029-6933)
- Jiahui Li (ORCID: https://orcid.org/0000-0003-4828-9440)
Institutions
- Hebei University of Technology (CN)
- Institute of Microelectronics (CN)
Publication Details
- Published
- 2025-03-24
- DOI
- https://doi.org/10.1109/cstic64481.2025.11018013
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Natural Science Foundation of Hebei Province