Study on the Influence of Surfactant Concentration on the Planarization Effect of Quartz Wafers

Quartz crystal components are widely used in mobile communications and optical communications. With the rapid development of intelligent electronic products and mobile terminals, there is a pressing demand for compact quartz crystal devices that are reliable in performance and offer higher, more stable output frequencies. The surface quality of quartz crystals directly affects their frequency stability and temperature-frequency characteristics, and other physical properties. Despite ultra-precision polishing, the surface and subsurface of the quartz wafer continue to exhibit a damage layer. Chemical mechanical polishing (CMP) can precisely control the surface quality (Sq) of quartz wafers. Surfactants, as a crucial component of the polishing slurry, effectively enhance the surface smoothness and uniformity of quartz wafers. This study investigates the impact of different concentrations of isooctanol polyoxyethylene ether(JFC-E) as a surfactant on the surface quality of quartz wafers after CMP. Experimental results indicate that at a pH of 10.0, a cerium oxide (CeO2) concentration of 2 wt%,a hydrogen peroxide (H2O2) concentration of 1.2 wt%, and a JFC-E concentration of 90 ppm, the sample achieved the finest surface quality, with Sq of only 0.0862 nm. This result represents a significant improvement when compared to the initial surface quality of the simple, which was characterized by Sq of 2.3690 nm.