Study on the enhancement of surface quality of polyimide films by chemical mechanical polishing

The traditional chemical mechanical polishing (CMP) process has challenges in achieving high precision surface polishing of polyimide films. In this paper, the influence of different polishing pressure and polishing time on polishing speed and surface quality is studied. This research shows that the higher the polishing pressure, the faster the removal rate of polyimide film. Polishing time does not affect the removal rate. The choice of polishing pad has more influence on polishing rate and indicated roughness.