Optimization of Filling Capacity in Harp Process for STI Void Defect Reduction in Advanced Process

STI void, which is formed because the HARP deposition cannot effectively fill oxide and will lead to the loss of a layer of film in the subsequent process, resulting in lower yield. In this paper, STI void was exposed on the surface by adding dip oxide firstly, and then STI void can be detected by the EBI machine. HARP filling performance is optimized by reducing chemical flow rate and adjusting the offset setting of the machine. The results show that this action can successfully improve 99% of STI void defects, improving product yield.