Accelerated Simulation of Electromigration Based on Equivalent Circuit
Electromigration (EM) is a critical reliability issue in modern VLSI design. Traditional EM models often struggle with the trade-off between accuracy and computational efficiency. To address this, we propose an accelerated simulation approach using finite difference methods (FDM) to transform the EM system into a lumped-element circuit model. This model is further optimized with model order reduction (MOR) techniques, enabling faster and accurate stress evolution analysis. Our approach accommodates non-uniform stress distributions and time-varying current conditions. Experimental results show that our method achieves high accuracy compared to finite element analysis, providing a scalable solution for transient EM analysis in large-scale interconnects.
Authors
- Hai‐Bao Chen (ORCID: https://orcid.org/0000-0001-7046-3455)
- Hengyi Zhu (ORCID: https://orcid.org/0009-0007-2236-0313)
Institutions
- Shanghai Jiao Tong University (CN)
Publication Details
- Published
- 2025-03-24
- DOI
- https://doi.org/10.1109/cstic64481.2025.11017973
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Key Research and Development Program of China