Accelerated Simulation of Electromigration Based on Equivalent Circuit

Electromigration (EM) is a critical reliability issue in modern VLSI design. Traditional EM models often struggle with the trade-off between accuracy and computational efficiency. To address this, we propose an accelerated simulation approach using finite difference methods (FDM) to transform the EM system into a lumped-element circuit model. This model is further optimized with model order reduction (MOR) techniques, enabling faster and accurate stress evolution analysis. Our approach accommodates non-uniform stress distributions and time-varying current conditions. Experimental results show that our method achieves high accuracy compared to finite element analysis, providing a scalable solution for transient EM analysis in large-scale interconnects.

Authors

Institutions

Publication Details

Published
2025-03-24
DOI
https://doi.org/10.1109/cstic64481.2025.11017973
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.00

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Accelerated Simulation of Electromigration Based on Equivalent Circuit

Hai‐Bao Chen, Hengyi Zhu
Copper Interconnects and Reliability
article

Accelerated Simulation of Electromigration Based on Equivalent Circuit

Hai‐Bao Chen, Hengyi Zhu
article en

Abstract

Electromigration (EM) is a critical reliability issue in modern VLSI design. Traditional EM models often struggle with the trade-off between accuracy and computational efficiency. To address this, we propose an accelerated simulation approach using finite difference methods (FDM) to transform the EM system into a lumped-element circuit model. This model is further optimized with model order reduction (MOR) techniques, enabling faster and accurate stress evolution analysis. Our approach accommodates non-uniform stress distributions and time-varying current conditions. Experimental results show that our method achieves high accuracy compared to finite element analysis, providing a scalable solution for transient EM analysis in large-scale interconnects.

Shanghai Jiao Tong University (CN)
National Key Research and Development Program of China
Openalex Percentile: Top 93%
Copper Interconnects and Reliability
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.