Application and Mechanism Research of Novel Green Chelating Agent in CMP
In this paper, the effect of poly-aspartic acid sodium salt as a novel green and efficient chelating agent on improving the copper removal rate and surface quality is studied. Characterization is given by measuring particle size, zeta potential, contact angle, and atomic force microscopy (AFM), as well as density functional theory (DFT).
Authors
- A. Q. Liu (ORCID: https://orcid.org/0000-0002-0126-5778)
- Hongdong Zhao (ORCID: https://orcid.org/0000-0002-1251-0943)
- Yundian Yang
- Yuling Liu
- Tongtong Zhang (ORCID: https://orcid.org/0009-0005-9163-1186)
- Chong Luo (ORCID: https://orcid.org/0009-0007-1661-7792)
- Lijun Dong (ORCID: https://orcid.org/0009-0008-8971-2229)
Institutions
- Hebei University of Technology (CN)
- Semiconductor Manufacturing International (China) (CN)
Publication Details
- Published
- 2025-03-24
- DOI
- https://doi.org/10.1109/cstic64481.2025.11017849
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China