Thicker and Better Semiconductor Passivation Layers for Zero Defect Automotive Applications on 12-Inch 90-NM BCD Process

The primary purpose of the passivation layer is to protect the semiconductor and is usually deposited in the final stage of semiconductor manufacturing. The performance of the passivation layer usually determines the stability of the semiconductor chip. In practice, thin passivation layers often make it difficult for chips to withstand temperature cycling tests. In the development of automotive platforms, the passivation layers need to be optimised to meet the more demanding test conditions. A series of experiments were therefore carried out on the thickness and composition of the passivation layer. The experiments proved that a thicker passivation layer could meet the higher application requirements.