Comparison of simulation and actual test results and selection of molding material in Flip-Chip Package

The warping problem has become more and more important to the reliablity of solder joint with the development of packaging technology, and how to accurately predict package warping has attracted a lot of attention. In this paper, the effect of EMC(Epoxy molding compound) type on the warping of FC(Flip-Chip) package are investigated using Ansys software. And the strip model of Flip Chip Chip Scale Package was conducted according to the real design. Besides, the warping of strip for FC package is important to the product yield, the warping behavior of real products was compared with simulation results. Results suggested that reasonable consideration of EMC’s shrinkage rate in products can make simulation and testing results more consistent.