Impact of Carrier Lining Structure on the Wafer Edge Stress in Chemical Mechanical Double-Sided Polishing

Chemical Mechanical Double-Sided Polishing (DSP) is a crucial step in the processing of chip substrate materials. However, the wafer edge roll-off phenomenon during DSP deteriorates wafer edge flatness. By establishing a finite element model, this study investigates the impact of the carrier lining structure on the wafer edge stress during DSP. The results show that the wedge-shaped lining structure can effectively reduce stress concentration at wafer edge, thus improving wafer edge flatness. Theoretically, this study provides guidance for enhancing wafer edge flatness.