Cleaning and Assessing Particles from Polymer Materials Used in Semiconductor Manufacutring Tool

Ultrasonic cleaning is a mature technique to remove particles ranging from micron to sub-micron from a wafer surface. In this study, the effectiveness of an in-house cleaning procedure in removing submicron particle is investigated. The LPC results indicate that the IPA soaking increase the removal of particles and a single ultrasonic cleaning is less efficient to removal 1 μm or larger particles from polymer surface. This paper also studied the particles residue in ultrasonic water during the ultrasonic cleaning and a 1-day use, the overflowing water for 1-hour is sufficient to remove particles from PPU surface.