Mesoporous CeO<sub>2</sub> Particle Abrasives with High Specific Surface Area for Enhanced Chemical Mechanical Polishing Performance
In this paper, CeO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> mesoporous spheres were prepared by an effective method for application as abrasive particles in chemical mechanical polishing (CMP). It is found that slurry containing the mCeO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> provided scratch-free surfaces and improved removal rate by atomic force microscopy (AFM).
Authors
- Jinhua Liu (ORCID: https://orcid.org/0000-0001-9671-0135)
- Xin-Ping Qu (ORCID: https://orcid.org/0000-0001-6004-7167)
- Wenjing Hou (ORCID: https://orcid.org/0000-0003-2168-9145)
- Wei Yuan (ORCID: https://orcid.org/0000-0002-2728-6841)
- Linyi Shen
- Fan Yang (ORCID: https://orcid.org/0000-0002-8975-7979)
- Fan Zhang (ORCID: https://orcid.org/0000-0001-7886-6144)
- Simin Li
- Hui Cun Shen (ORCID: https://orcid.org/0000-0003-4800-437X)
Institutions
- Donghua University (CN)
- Fudan University (CN)
- Inner Mongolia University (CN)
- Shanghai Fudan Microelectronics (China) (CN)
Publication Details
- Published
- 2025-03-24
- DOI
- https://doi.org/10.1109/cstic64481.2025.11017880
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00