Study on the Relationship between Transmittance and Polish Time

As the semiconductor devices of integrated circuits achieve higher levels of integration, the increasingly significant planarization impact of transmission ratio (TR) on chemical mechanical planarization (CMP) is becoming more pronounced. Different transmission ratio products may lead to abnormal Endpoint curves when used with Endpoint system, including instances like unstable Endpoint signals and timeouts. This paper presents a technique for ensuring the secure grasping of Endpoint by achieve stability in the platen 2 remove amount through modifying platen 1 polish time, additionally, a database was established to record the connections between transmission ratio and platen 1 polish time. The study demonstrates that the stability of the Endpoint curve can be achieved by regulating platen 1 polish time through the database, which is based on different transmission ratio.