Effects of Injection Volume and Temperature on Spin Coating Uniformity: an Openfoam Simulation Study

Maintaining the uniformity of the photoresist layer during the spin coating subprocess of photolithography is crucial for subsequent processes in wafer fabrication. Poor spin coating performance can lead to photoresist waste and defects in the final chip. In this study, we employed OpenFOAM simulations to model the spin coating process on a wafer-sized substrate, focusing on the impact of key process factors—photoresist injection volume and substrate temperature—on coating uniformity. The results indicate that the injection volume of the photoresist and the substrate temperature significantly affect the morphology of the photoresist film during the spin coating process, providing valuable insights for optimizing the coating process.