White-Pixel Performance Improvement on CIS VIISta Trident Application

In the CMOS image sensor manufacturing process, the pinging layer in the pixel area is particularly sensitive and prone to metal contamination. This paper demonstrated a novel method to improve white-pixel (WP) performance through enhancements in the implantation process beyond hardware in MRK and TPFG. Through a series of experiments, feasible experimental conditions were obtained to highly improve the performance of WP under both high and low light yield test conditions. We have successfully helped customer to improve the yield on the road of pixel improvement.