Modeling of NTD Resist Shrinkage Based on Spring-Mass System
The shrinkage effect of negative tone development (NTD) process is a major factor influencing the accuracy of resist models. As a result, incorporating a resist model that accounts for this shrinkage is crucial for precise lithography simulations in NTD process. This paper presents a practical workflow of building a resist model considering shrinkage effect in NTD process. Simulation results demonstrate that the proposed model effectively captures this phenomenon, which provides a possibility for significantly improving the prediction accuracy of NTD simulations.
Authors
- Yayi Wei (ORCID: https://orcid.org/0000-0003-3733-3274)
- Lisong Dong
- Di Yao (ORCID: https://orcid.org/0000-0003-1778-8319)
Institutions
- Chinese Academy of Sciences (CN)
- Institute of Microelectronics (CN)
Publication Details
- Published
- 2025-03-24
- DOI
- https://doi.org/10.1109/cstic64481.2025.11018025
- Primary Topic
- Advancements in Photolithography Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Chinese Academy of Sciences
- Fundamental Research Funds for the Central Universities