Alleviating high temperature magnesium implanted radiation damage of GaN through nitrogen plasma surface treatment

Abstract A novel nitrogen plasma treatment to attenuate the radiation damage in Mg-ion implanted GaN is proposed. The effect of nitrogen plasma process parameters, such as radio frequency power (50–100 W) and processing time (2.5–5 min), on the surface and bulk material properties of GaN has been investigated. The depth profile measured by secondary ion mass spectroscopy shows that the doped Mg concentration and depth box profile are 1 × 10 19 cm −3 and 100 nm, respectively, being consistent with the simulated results obtained using Stopping and Range of Ions in Matter computer code. The transmission line method shows a notable reduction in contact resistance for the Mg-ion implanted sample treated with nitrogen plasma at 50 W for 2.5 min, compared to the control, as-implanted sample. X-ray photoelectron spectroscopy of nitrogen treated samples at 50 W indicates an increase in the occupied area of Ga–N bonds on the surface, which are attributed to the mitigation of nitrogen-related defects. Raman spectroscopy shows an enhancement in crystalline quality, and the alleviation of compressive stress. The results suggest that nitrogen plasma treatment at 50 W followed by rapid thermal annealing can effectively remove radiation induced damage in Mg-ion implanted GaN.

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Publication Details

Journal
Journal of Physics D Applied Physics
Published
2025-06-03
DOI
https://doi.org/10.1088/1361-6463/addfe5
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26

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article

Alleviating high temperature magnesium implanted radiation damage of GaN through nitrogen plasma surface treatment

V.R. Dhanak, S. Hall, Richard J. Potter, Der-Sheng Chao et al.
1 citations
Journal of Physics D Applied Physics
GaN-based semiconductor devices and materials
1.26
article

Alleviating high temperature magnesium implanted radiation damage of GaN through nitrogen plasma surface treatment

V.R. Dhanak, S. Hall, Richard J. Potter, Der-Sheng Chao, Chih‐Ming Lin, Ivona Z. Mitrović, Harry Finch, Jenq‐Horng Liang, Ya-Xun Lin
article en
1 citations

Abstract

Abstract A novel nitrogen plasma treatment to attenuate the radiation damage in Mg-ion implanted GaN is proposed. The effect of nitrogen plasma process parameters, such as radio frequency power (50–100 W) and processing time (2.5–5 min), on the surface and bulk material properties of GaN has been investigated. The depth profile measured by secondary ion mass spectroscopy shows that the doped Mg concentration and depth box profile are 1 × 10 19 cm −3 and 100 nm, respectively, being consistent with the simulated results obtained using Stopping and Range of Ions in Matter computer code. The transmission line method shows a notable reduction in contact resistance for the Mg-ion implanted sample treated with nitrogen plasma at 50 W for 2.5 min, compared to the control, as-implanted sample. X-ray photoelectron spectroscopy of nitrogen treated samples at 50 W indicates an increase in the occupied area of Ga–N bonds on the surface, which are attributed to the mitigation of nitrogen-related defects. Raman spectroscopy shows an enhancement in crystalline quality, and the alleviation of compressive stress. The results suggest that nitrogen plasma treatment at 50 W followed by rapid thermal annealing can effectively remove radiation induced damage in Mg-ion implanted GaN.

Journal of Physics D Applied PhysicsVol. 58(26)
University of Liverpool (GB), National Tsing Hua University (TW)
Engineering and Physical Sciences Research Council
Openalex Percentile: Top 21%
GaN-based semiconductor devices and materials
1.26
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