Comparison of Continuous and Pulsed Low-Power DC Sputtered Ti Thin Films Deposited at Room Temperature

Titanium thin films with thicknesses of up to 105 nm were deposited on borosilicate glass implementing low-power continuous (25 W) and pulsed (85 W, with an ultra-low duty cycle) DC magnetron sputtering. The characteristics of the resulting films were studied via atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS), VIS spectroscopy, and four-point-probe measurements. Both deposition modes yield films with low surface roughness, and AFM analysis showed no topographical features indicative of columnar-and-void structures. The films exhibited high optical reflectivity and stable transmittance and reflectance across the visible spectrum. The electric resistivity could be measured even at single nanometer thickness, emphasizing the metallic character of the films and approaching the bulk titanium value at higher film thicknesses. The low power regime of magnetron sputter deposition not only offers the possibility of studying the development of physical characteristics during the growth of ultra-thin films but also provides the advantage of extremely low heat development and no evident mechanical stress on the substrate during the coating process. These results outline a path for low-power DC sputtering as a reliable approach for studying the evolution of functional properties in ultra-thin films and for the gentle fabrication of coatings where thermal stress must be avoided, making the method compatible with temperature-sensitive applications.