Charge Transport in GaN High Electron Mobility Transistor With Positive Substrate Bias

Charge transport in 650-V-rated GaN high electron mobility transistors (HEMTs) was investigated using positive substrate bias up to +600 V. Positive substrate bias resulted in a reduction in channel current, attributed to negative charge storage in the buffer, resulting in up to a >50% reduction in the 2-D electron gas (2DEG) channel density. The dynamics of the accumulated charge was investigated using recovery transients after substrate bias stress, with recovery times >1000 s for substrate stress bias <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$&gt;+$</tex-math></inline-formula>200 V. The recovery time was reduced significantly with the application of a negative substrate bias of short duration, immediately following the positive substrate bias stress. A comprehensive explanation is presented, which requires a detailed understanding of the transport (both ohmic and non-ohmic) through each of the layers in the epitaxial stack.

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Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2025-06-02
DOI
https://doi.org/10.1109/ted.2025.3571004
Citations
2
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
2.52

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article

Charge Transport in GaN High Electron Mobility Transistor With Positive Substrate Bias

Stefaan Decoutere, Matthew D. Smith, Zequan Chen, Michael J. Uren et al.
2 citations
IEEE Transactions on Electron Devices
GaN-based semiconductor devices and materials
2.52
article

Charge Transport in GaN High Electron Mobility Transistor With Positive Substrate Bias

Stefaan Decoutere, Matthew D. Smith, Zequan Chen, Michael J. Uren, Anurag Vohra, Benoit Bakeroot, Martin Kuball, Peng Huang
article en
2 citations

Abstract

Charge transport in 650-V-rated GaN high electron mobility transistors (HEMTs) was investigated using positive substrate bias up to +600 V. Positive substrate bias resulted in a reduction in channel current, attributed to negative charge storage in the buffer, resulting in up to a >50% reduction in the 2-D electron gas (2DEG) channel density. The dynamics of the accumulated charge was investigated using recovery transients after substrate bias stress, with recovery times >1000 s for substrate stress bias <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$&gt;+$</tex-math></inline-formula>200 V. The recovery time was reduced significantly with the application of a negative substrate bias of short duration, immediately following the positive substrate bias stress. A comprehensive explanation is presented, which requires a detailed understanding of the transport (both ohmic and non-ohmic) through each of the layers in the epitaxial stack.

IEEE Transactions on Electron DevicesVol. 72(7)
Ghent University (BE), University of Bristol (GB), IMEC (BE)
Engineering and Physical Sciences Research Council
Affordable and clean energy
Openalex Percentile: Top 11%
GaN-based semiconductor devices and materials
2.52
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Charge Transport in GaN High Electron Mobility Transistor With Positive Substrate Bias — Stefaan Decoutere, Matthew D. Smith, et al. · IEEE Transactions on Electron Devices (2025) | TGRS Research Map | TGRS