Additive Manufacturing High‐Performance Al <sub>2</sub> O <sub>3</sub> Ceramic for Circuit Board
ABSTRACT In this work, stereo lithography apparatus (SLA) additive manufacturing (AM) was employed to fabricate the Al 2 O 3 ceramic substrate for circuit board. The influence of sintering temperature on microstructure and mechanical properties was investigated. The XRD and SEM were carried on to detect the phase transformation and morphology. With an increment of sintering temperature, the grain size of bulks displays an increasing tendency, while the flexural strength exhibits a trend of first increasing, reaches a peak, and subsequently decreasing. This work provides a method to prepare a high‐performance Al 2 O 3 ceramic, which can be applied in electronics and semiconductors.
Authors
- Dongxing Zhang (ORCID: https://orcid.org/0000-0002-2526-8391)
- Haiwei Gu (ORCID: https://orcid.org/0000-0002-7598-5022)
- Zhenghao Pu (ORCID: https://orcid.org/0000-0002-6251-2699)
- Yan Chen (ORCID: https://orcid.org/0000-0002-4742-6944)
- Busheng Zhang
- Wangwang Ding (ORCID: https://orcid.org/0000-0002-3484-4573)
- Bo Li (ORCID: https://orcid.org/0000-0001-6429-1765)
- Qiuquan Guo
Institutions
- Tohoku University (JP)
- BYD (China) (CN)
Publication Details
- Journal
- Electrical materials and applications.
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1049/ema3.70015
- Citations
- 1
- Primary Topic
- Additive Manufacturing and 3D Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.68
Funders
- China Postdoctoral Science Foundation