Thermal Impulse Response Analysis of Element Arrays in Flexible Electronic Devices

The heat generated by flexible electronic devices during operation leads to deformation of the components, which is highly likely to affect their functionality. A finite element analysis model for the thermal impulse responses of the flexible electronic device element arrays were established, and the effects of the layer thickness ratio of the encapsulation layer to the substrate layer of the flexible electronic device element on the thermal stability of the overall structure, as well as the thermal impulse responses of the flexible electronic device components, were investigated. The results show that, the temperature of the functional layer center element rises by about 0.47% and the thermal stress increases by about 25.87% with the thermal impulse load increasing from 50 W/m² to 150 W/m². With the layer thickness ratio of the encapsulation layer to the substrate layer increasing from 0.2 to 5.0, the thermal stress of the functional layer center unit decreases by about 92%, the thermal strain decreases by about 99%, and the displacement along the layer thickness decreases by about 86%. The work provides basic data for the optimization design and protection against thermal impulse loading on flexible electronic device components.