Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode
Recent advances in glass-ceramics research have expanded their applications in astronomy, optoelectronics, and laser systems. However, precision cutting technology remains challenging. This study optimized picosecond laser processing parameters for 600 nm-thick glass-ceramics, revealing critical influences of point spacing, laser energy, and pulse number. Atomic force microscopy showed that 1 µm processing spacing enabled uniform ablation grooves with optimal roughness. Two-pulse configurations achieved the most consistent surface improvement. At 12.5 W incident power, samples exhibited minimized average roughness (219 nm) with localized values reaching 208 nm, alongside 1.2 N breaking stress.
Authors
- Qingguo Gao (ORCID: https://orcid.org/0000-0002-5927-188X)
- Xinjian Pan (ORCID: https://orcid.org/0000-0001-8745-5718)
- Yi Cai (ORCID: https://orcid.org/0000-0002-1694-7413)
- Yi Song (ORCID: https://orcid.org/0000-0001-9632-404X)
- Jianjun Yang (ORCID: https://orcid.org/0000-0001-8040-8636)
- Zhili Li (ORCID: https://orcid.org/0000-0002-1190-7949)
- Zhi Zhang (ORCID: https://orcid.org/0000-0002-8077-1600)
- Yunfei Duan
- Cheng Peng (ORCID: https://orcid.org/0000-0003-2177-1536)
- Jinxuan Li (ORCID: https://orcid.org/0000-0001-9220-2272)
- Chunjian Deng
Institutions
- University of Electronic Science and Technology of China (CN)
- Shenzhen University (CN)
Publication Details
- Journal
- Applied Sciences
- Published
- 2025-05-30
- DOI
- https://doi.org/10.3390/app15116172
- Primary Topic
- Laser Material Processing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Natural Science Foundation of Guangdong Province