A Broadband Millimeter-Wave 5G Front-End Module IC in 22nm CMOS FD-SOI
In this paper, we present a broadband millimeter-wave (mm-Wave) 5G front-end module (FEM) integrated circuit (IC) designed in an advanced 22 nm CMOS FD-SOI (Fully-Depleted Silicon-On-Insulator) process offered by GlobalFoundries (GF). The broadband mm-Wave 5G RF (radio-frequency) FEM IC includes a broadband power amplifiers (PA), a low-noise-amplifier (LNA), and a SPDT (single-pole double-throw) switch. The performance of the FEM IC is simulated with post-layout parasitic extraction (PEX) and compared vs. available measured data. This work suggests an all-silicon RF FEM IC may be attractive for some commercial mm-Wave 5G and 6G applications.
Authors
- Jill Mayeda (ORCID: https://orcid.org/0000-0002-0575-291X)
- Donald Y.C. Lie (ORCID: https://orcid.org/0000-0002-1788-8910)
- Clint Sweeney
- Jerry Lopez
- Liang-Wei Ouyang
Institutions
- Texas Tech University (US)
Publication Details
- Published
- 2025-03-29
- DOI
- https://doi.org/10.1109/icct-pacific63901.2025.11012880
- Primary Topic
- Radio Frequency Integrated Circuit Design
- Type
- article
- Field-Weighted Citation Impact
- 0.00