Graphene-Based FPGA Design and Optimization at the 7nm FinFET Technology Node

Emerging graphene-based interconnects exhibit excellent conductivity, rendering them a promising alternative to traditional interconnect materials. The energy consumption and delay of field-programmable gate arrays (FPGAs) are significantly influenced by global routing, which presents a compelling opportunity for graphene interconnect technology. This study examines the potential benefits of replacing copper (Cu), the conventional interconnect material, with graphene. Three interconnect technologies are examined: Cu interconnects, improved graphene-capped Cu interconnects, and thick graphene. An interconnect/system co-design framework is designed to systematically evaluate their performance differences. Concerning graphene material-level parameters, our focus is on the impact of graphene contact resistance and mean-free-path on performance. Benchmark simulations indicate that graphene-based interconnects can enhance the energy-delay product of circuits by up to 32% in comparison to conventional Cu interconnects at the 7nm FinFET technology node.

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Publication Details

Published
2025-04-23
DOI
https://doi.org/10.1109/isqed65160.2025.11014392
Citations
1
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
Type
article
Field-Weighted Citation Impact
0.73

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article

Graphene-Based FPGA Design and Optimization at the 7nm FinFET Technology Node

Qilian Liang, Chenyun Pan, Liuting Shang, Zhenlin Pei et al.
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Advancements in Semiconductor Devices and Circuit Design
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article

Graphene-Based FPGA Design and Optimization at the 7nm FinFET Technology Node

Qilian Liang, Chenyun Pan, Liuting Shang, Zhenlin Pei, Sungyong Jung, Sheng Lu
article en
1 citations

Abstract

Emerging graphene-based interconnects exhibit excellent conductivity, rendering them a promising alternative to traditional interconnect materials. The energy consumption and delay of field-programmable gate arrays (FPGAs) are significantly influenced by global routing, which presents a compelling opportunity for graphene interconnect technology. This study examines the potential benefits of replacing copper (Cu), the conventional interconnect material, with graphene. Three interconnect technologies are examined: Cu interconnects, improved graphene-capped Cu interconnects, and thick graphene. An interconnect/system co-design framework is designed to systematically evaluate their performance differences. Concerning graphene material-level parameters, our focus is on the impact of graphene contact resistance and mean-free-path on performance. Benchmark simulations indicate that graphene-based interconnects can enhance the energy-delay product of circuits by up to 32% in comparison to conventional Cu interconnects at the 7nm FinFET technology node.

South Dakota State University (US), The University of Texas at Arlington (US)
National Science Foundation
Openalex Percentile: Top 28%
Advancements in Semiconductor Devices and Circuit Design
0.73
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Graphene-Based FPGA Design and Optimization at the 7nm FinFET Technology Node — Qilian Liang, Chenyun Pan, et al. · (2025) | TGRS Research Map | TGRS