Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices (Adv. Sci. 20/2025)
Flexible Printed Electronics In article number 2415272, Wedyan Babatain and co‐workers introduce a laser‐enabled, additive process for fabricating flexible, double‐sided PCBs. The E‐LIG process combines laser‐induced graphene patterning with copper electrodeposition, creating high‐resolution circuits that integrate sensors and actuators directly on flexible or transparent substrates. This scalable method is ideal for wearables, soft robotics, and interactive smart surfaces. [Image: see text]
Authors
- Hiroshi Ishii (ORCID: https://orcid.org/0000-0003-4918-8908)
- Wedyan Babatain (ORCID: https://orcid.org/0000-0001-7526-5749)
- Neil Gershenfeld (ORCID: https://orcid.org/0000-0001-8470-5777)
- Christine Park (ORCID: https://orcid.org/0000-0002-5261-9820)
Publication Details
- Journal
- Advanced Science
- Published
- 2025-05-01
- DOI
- https://doi.org/10.1002/advs.202570148
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00