Impact of Cap Layer Engineering on the DC and RF Performance of N-Polar AlGaN/GaN HEMTs

In this work, we investigated the impact of cap layer engineering on the N-polar AlGaN/GaN HEMTs. By varying the drain side n+ GaN cap layer length (L<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">cap</inf>) from 150 nm to 350 nm, we analyze its effects on the key DC and RF performance parameters, including transconductance (g<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m</inf>), on-resistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf>), cut-off frequency (f<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</inf>), and the on-state to off-state current ratio (I<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf>/I<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">OFF</inf> ). The results indicates that increasing L<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">cap</inf> enhanced the drain current, reduced the R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf>, and improved the f<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</inf>. The DC measurements shows a maximum drain current of 1.02 mA/μm at a gate-source voltage (V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GS</inf>) of 2 V, a maximum g<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m</inf> of 0.81 mS/μm at drain-source voltage (V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</inf>) of 5 V for L<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">cap</inf> = 350 nm. A peak f<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</inf> of 68.7 GHz was measured at a V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</inf> of 5 V for L<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">cap</inf> = 350 nm. These findings emphasizes the significant role of cap layer optimization in enhancing the electrostatic and transport properties of N-polar HEMTs, making them promising candidates for high-frequency and high-power applications.

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Published
2025-04-05
DOI
https://doi.org/10.1109/devic63749.2025.11012396
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3
Primary Topic
GaN-based semiconductor devices and materials
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article
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article

Impact of Cap Layer Engineering on the DC and RF Performance of N-Polar AlGaN/GaN HEMTs

Kaushik Mazumdar, Chumki Das
3 citations
GaN-based semiconductor devices and materials
3.77
article

Impact of Cap Layer Engineering on the DC and RF Performance of N-Polar AlGaN/GaN HEMTs

Kaushik Mazumdar, Chumki Das
article en
3 citations

Abstract

In this work, we investigated the impact of cap layer engineering on the N-polar AlGaN/GaN HEMTs. By varying the drain side n+ GaN cap layer length (L<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">cap</inf>) from 150 nm to 350 nm, we analyze its effects on the key DC and RF performance parameters, including transconductance (g<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m</inf>), on-resistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf>), cut-off frequency (f<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</inf>), and the on-state to off-state current ratio (I<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf>/I<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">OFF</inf> ). The results indicates that increasing L<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">cap</inf> enhanced the drain current, reduced the R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf>, and improved the f<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</inf>. The DC measurements shows a maximum drain current of 1.02 mA/μm at a gate-source voltage (V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GS</inf>) of 2 V, a maximum g<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m</inf> of 0.81 mS/μm at drain-source voltage (V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</inf>) of 5 V for L<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">cap</inf> = 350 nm. A peak f<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</inf> of 68.7 GHz was measured at a V<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</inf> of 5 V for L<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">cap</inf> = 350 nm. These findings emphasizes the significant role of cap layer optimization in enhancing the electrostatic and transport properties of N-polar HEMTs, making them promising candidates for high-frequency and high-power applications.

Indian Institute of Technology Dhanbad (IN)
Openalex Percentile: Top 7%
GaN-based semiconductor devices and materials
3.77
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