A Partitioning-Based CAD Flow for Interposer-Based Multi-Die FPGAs
Multi-die interposer-based FPGA architectures present several design challenges: (i) limited inter-die connectivity (interposer) resources and (ii) increased interposer delays compared to intra-die routing. Addressing these challenges is critical, as compared to intra-die routing, they directly impact the routability, routed wirelength (rWL) and maximum clock frequency (Fmax) of the design. In this paper, we present a partitioning-based CAD flow tailored for interposer-based multi-die FPGA architectures. Central to our approach is FPGAPart, the first open-source timing-driven netlist partitioner that can handle FPGA designs while addressing modern architectural constraints. We integrate FPGAPart with the open-source tool VTR 7.0. In particular, we use: (i) VTR 7.0's pre-packing solutions as clustering hints during partitioning and (ii) the FP-Growth algorithm [14] to detect frequently occurring patterns (instances) across multiple timing paths for clustering. Additionally, we introduce neighborhood influences-based cutting planes into the core ILP solver in FPGAPart, resulting in a ~38× ILP runtime speedup with < 1 % degradation in solution quality, compared to using no neighborhood influences. Compared to the default VTR 7.0, our flow achieves a geometric mean improvement of ~3% in rWL and ~3% in Fmax for a two-die configuration, with similar improvements across other configurations. Compared to hMETIS [17], METIS [18] and TritonPart [5], FPGAPart achieves improvements up to ~4% in rWL and ~7 % in Fmax for a two-die configuration, with similar improvements across other configurations.
Authors
- Kristofer Vorwerk
- Grace Zgheib (ORCID: https://orcid.org/0000-0002-1476-2984)
- Mahesh A. Iyer (ORCID: https://orcid.org/0000-0002-1045-0019)
- Jason Luu
- Bodhisatta Pramanik (ORCID: https://orcid.org/0009-0004-6014-1048)
- Andrew B. Kahng (ORCID: https://orcid.org/0000-0002-4490-5018)
Institutions
- University of California San Diego (US)
- Altera (United Kingdom) (GB)
- Intel (United Kingdom) (GB)
Publication Details
- Published
- 2025-05-04
- DOI
- https://doi.org/10.1109/fccm62733.2025.00063
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Intel Corporation