Photon Event Summation and External Readout for Fill Factor Preservation in 32×32 FSI SPAD Array

Single-photon avalanche diodes (SPADs), integrated in CMOS technology, offer high-gain detection of low-intensity optical signals. SPADs are widely adopted in imaging systems, including both 2D and 3D depth sensing. As SPAD arrays scale to higher resolutions, backside illumination (BSI) is one approach to improving fill factor (FF) and routing, though it increases fabrication complexity. Alternatively, in frontside illumination (FSI), the integration of circuitry within the pixel area results in a significant reduction of the FF. Thus, this brief proposes an external counter architecture with a photon event summing and coincidence detection scheme. Unlike conventional FSI designs, it preserves FF and improves routing efficiency, which facilitates scalability. This architecture is well suited for SPAD-based imaging and 3D sensing, which require high pixel resolution and compact signal integration.

Authors

Institutions

Publication Details

Journal
IEEE Transactions on Circuits & Systems II Express Briefs
Published
2025-05-28
DOI
https://doi.org/10.1109/tcsii.2025.3574348
Primary Topic
Advanced Optical Sensing Technologies
Type
article
Field-Weighted Citation Impact
0.00

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Photon Event Summation and External Readout for Fill Factor Preservation in 32×32 FSI SPAD Array

Jinwook Burm, Youngmin Cho, Jonghyuk Chae
IEEE Transactions on Circuits & Systems II Express Briefs
Advanced Optical Sensing Technologies
article

Photon Event Summation and External Readout for Fill Factor Preservation in 32×32 FSI SPAD Array

Jinwook Burm, Youngmin Cho, Jonghyuk Chae
article en

Abstract

Single-photon avalanche diodes (SPADs), integrated in CMOS technology, offer high-gain detection of low-intensity optical signals. SPADs are widely adopted in imaging systems, including both 2D and 3D depth sensing. As SPAD arrays scale to higher resolutions, backside illumination (BSI) is one approach to improving fill factor (FF) and routing, though it increases fabrication complexity. Alternatively, in frontside illumination (FSI), the integration of circuitry within the pixel area results in a significant reduction of the FF. Thus, this brief proposes an external counter architecture with a photon event summing and coincidence detection scheme. Unlike conventional FSI designs, it preserves FF and improves routing efficiency, which facilitates scalability. This architecture is well suited for SPAD-based imaging and 3D sensing, which require high pixel resolution and compact signal integration.

IEEE Transactions on Circuits & Systems II Express BriefsVol. 72(11)
Sogang University (KR)
Ministry of Trade, Industry and Energy, Korea Institute for Advancement of Technology, National Research Foundation of Korea, IC Design Education Center, Ministry of Science and ICT, South Korea, Samsung, Korea Evaluation Institute of Industrial Technology
Openalex Percentile: Top 88%
Advanced Optical Sensing Technologies
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.