Preparation of <scp>DMP</scp>‐30/Polycaprolactone Microcapsules for One‐Component Epoxy Adhesive With Low Curing Temperature

ABSTRACT Low‐temperature curing two‐component thiols/epoxy adhesives with 2,4,6‐tris(dimethylaminomethyl) phenol (DMP‐30) are widely used in the electronic adhesives field due to their excellent bonding properties. However, they are complicated to operate, and their storage stability is generally poor. In this work, a novel DMP‐30 microcapsule‐type accelerator (MCs) was successfully fabricated using polycaprolactone (PCL) with a low melting point as shell material by the solvent evaporation method, which was applied to one‐component low‐temperature curing thiols/epoxy adhesives with a longer storage time. The morphology and structure of the MCs were verified, and the best parameters for preparing MCs were studied in experiments. The results showed that the size distribution was controlled to 10–30 μm with a core content of 30 wt% under the most appropriate condition. The storage time of the one‐component epoxy adhesive (MCs_2/EP) was determined to be 29 days by the change in viscosity, and it obtained an improvement of about 9.5% in shear strength of 19.38 ± 0.87 MPa for epoxy plates, cured at 80°C for 3 h. This study provides a novel idea for developing a one‐component epoxy adhesive.