Numerical Simulation of Nanofluid Heat Transfer Performance of High-Power Chips under Different Nozzle Array Conditions

随着电子技术的不断发展，芯片的散热问题变得越来越关键。传统散热技术在面对高热流密度时存在诸多不足之处，而射流冲击技术因其高效和快速等优势而备受关注。文章基于特定的腔体结构，采用数值模拟方法研究了三种不同的喷嘴–阵列形式和四种喷嘴结构，以及不同浓度的纳米流体对高热流密度芯片冷却性能的影响。研究结果表明：在对比喷嘴数量的案例中，相同条件下五个喷嘴均匀排布比三个喷嘴均匀排布模拟芯片的底面最高温度低了7.07 K；对比喷嘴结构的案例中，倒角型喷嘴的性能最好，模拟芯片的底面温度最高值仅309.92 K；对于3%浓度的氧化铝纳米流体而言，其换热性能比2%的纳米流体提升了11.1%，比4%浓度的只下降了8.3%。研究结果可为芯片散热技术优化提供重要的参考依据。With the continuous advancement of electronic technology, thermal management in chips has become increasingly critical. Traditional cooling technologies exhibit significant limitations in addressing high heat flux conditions, while jet impingement technology has gained prominence due to its high efficiency and rapid cooling capabilities. This study investigates the cooling performance of high heat flux chips using numerical simulations based on a specific cavity structure, focusing on three nozzle-array configurations, four nozzle geometries, and varying nanofluid concentrations. Key findings include: Under identical conditions, a uniform five-nozzle arrangement reduced the maximum temperature at the simulated chip’s bottom surface by 7.07 K compared to a three-nozzle configuration. Among nozzle structures, the chamfered nozzle demonstrated optimal performance, achieving a maximum bottom surface temperature of 309.92 K. For a 3% alumina nanofluid concentration, heat transfer performance improved by 11.1% compared to 2% concentration, with only an 8.3% reduction relative to the 4% concentration. These results provide critical insights for optimizing chip cooling technologies.