Comparative Analysis of Enamel Surface Integrity and Pulpal Temperature in Debonding Metallic Brackets: A Study of Two Intensity Levels of Diode Laser Versus Conventional Method
Diode laser-assisted brackets debonding conducted at low and high intensity settings produced better enamel preservation results than standard debonding methods. The pulpal temperature generated at the 3.5 W setting exceeded other measurements which justifies careful use of this method. A diode laser at 2.5 W offers a suitable tradeoff between enamel protection and pulpal thermal safety. <b>Key words:</b>Diode laser, orthodontic debonding, enamel integrity, pulpal temperature, metallic brackets.
Authors
- Remmiya Mary Varghese (ORCID: https://orcid.org/0000-0002-6320-2967)
- Ashwin George Mathew
- Shreya Kishore (ORCID: https://orcid.org/0000-0001-8728-041X)
- Leenath Thomas (ORCID: https://orcid.org/0000-0002-4742-0040)
- Reshma Mohan
Institutions
- AIMST University (MY)
- SRM Dental College (IN)
- Saveetha University (IN)
- Bharath University (IN)
Publication Details
- Journal
- Journal of Clinical and Experimental Dentistry
- Published
- 2025-01-01
- DOI
- https://doi.org/10.4317/jced.62738
- Primary Topic
- Laser and Thermal Forming Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00