Concurrent high thermal conductivity and high carrier mobility in tetragonal tantalum nitride
Semiconductor devices demand materials that exhibit exceptional carrier and heat transport; however, such materials have remained exceedingly scarce. Using rigorous first-principles calculations, we identify tetragonal tantalum nitride (t-TaN) as a narrow bandgap semiconductor that uniquely achieves both high thermal conductivity (κ) and high carrier mobility (μ). At room temperature, t-TaN demonstrates an extraordinary κ of up to 677 W m−1 K−1, surpassing that of most widely used semiconductors. This remarkable κ arises from the synergistic effects of phonon bunching and a substantial frequency gap in the phonon spectrum, which significantly suppresses phonon–phonon scattering. Even more strikingly, t-TaN exhibits exceptional hole μ exceeding 4700 cm2 V−1 s−1 at room temperature, outperforming all known high-κ bulk semiconductors. This ultrahigh μ is attributed to its elevated Fermi velocity and weak electron–phonon coupling, stemming from its unique electronic and phononic structures. These findings position t-TaN as a compelling candidate for advanced electronic and optoelectronic applications, while also offering a transformative perspective for discovering high-performance semiconductors with dual advantages.
Authors
- Xianyong Ding (ORCID: https://orcid.org/0000-0003-2490-7304)
- Xiaoyuan Zhou (ORCID: https://orcid.org/0000-0003-1088-0809)
- Zhenxiang Cheng (ORCID: https://orcid.org/0000-0003-4847-2907)
- Rui Wang (ORCID: https://orcid.org/0000-0002-5063-5691)
- Xuewei Lv (ORCID: https://orcid.org/0000-0003-1690-4373)
- Xin Jin (ORCID: https://orcid.org/0000-0001-8682-8615)
- Xiaolong Yang (ORCID: https://orcid.org/0000-0002-3249-483X)
- Dengfeng Li (ORCID: https://orcid.org/0000-0002-4189-400X)
- Jing Fan (ORCID: https://orcid.org/0000-0002-1981-1052)
Institutions
- Chongqing University of Posts and Telecommunications (CN)
- Chongqing Normal University (CN)
- Chongqing University (CN)
- University of Wollongong (AU)
- Southern University of Science and Technology (CN)
- Division of Materials Science and Engineering (AU)
Publication Details
- Journal
- Applied Physics Reviews
- Published
- 2025-05-27
- DOI
- https://doi.org/10.1063/5.0259103
- Citations
- 5
- Primary Topic
- Thermal properties of materials
- Type
- article
- Field-Weighted Citation Impact
- 2.59
Funders
- National Natural Science Foundation of China