Purion vs Paradigm Process Matching: Copy Exact Process or Copy Exact Output? : AEPM: Advanced Equipment Processes and Materials

As semiconductor manufacturing equipment continues to evolve, with newer model tools offering better process accuracy and precision, semiconductor fabs face the challenge of matching the processes that run on older machines (tools of record) with the same processes set up on newer style equipment. This is a case where copy exact process methodology does not work across vastly different platforms, and a copy exact output approach is needed. For Ion Implantation processes, it is particularly difficult to match the process output of batch machines to that of single-wafer tools. Variations in the implant angle set-up, beamline design, and handling mechanisms across implanter platforms create a nearly impossible task of matching the process exactly. While tight timelines for cross-fab technology transfers demand, in so far as possible, a copy-exact approach, device sensitivities can drive parametric shifts which highlight even the slightest hardware differences. This study will explore the various process knobs for optimization of a critical transistor gain parameter through a tilt-sensitive implant across several 300mm High Energy implant platforms (Axcelis HE3, Axcelis Paradigm XE, Axcelis Purion XE) and utilizing high precision SIMS analysis in conjunction with electrical test to gauge the device performance.