Compositional Analysis of Thick Silicon Nitride Films Using X-ray Photoelectron Spectroscopy

This paper presents inline and offline X-ray photoelectron spectroscopy (XPS) data of thick SiN films prepared by plasma-enhanced chemical vapor deposition (PECVD) and low-pressure chemical vapor deposition (LPCVD) techniques. The inline XPS monitors the stoichiometry of the film surface, while offline XPS is used to understand the entire thick film composition and Si/SiNx interface. For a complete compositional analysis, the XPS depth profile and detailed core-level spectra analysis are conducted for annealed and unannealed wafers. Finally, the XPS thickness is confirmed from cross-section images.

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Published
2025-05-05
DOI
https://doi.org/10.1109/asmc64512.2025.11010249
Primary Topic
Electron and X-Ray Spectroscopy Techniques
Type
article
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article

Compositional Analysis of Thick Silicon Nitride Films Using X-ray Photoelectron Spectroscopy

Yukta Timalsina, D.L. Harame, Sandra Schujman, Soumen Kar et al.
Electron and X-Ray Spectroscopy Techniques
article

Compositional Analysis of Thick Silicon Nitride Films Using X-ray Photoelectron Spectroscopy

Yukta Timalsina, D.L. Harame, Sandra Schujman, Soumen Kar, Lewis G. Carpenter, Christopher Baiocco
article en

Abstract

This paper presents inline and offline X-ray photoelectron spectroscopy (XPS) data of thick SiN films prepared by plasma-enhanced chemical vapor deposition (PECVD) and low-pressure chemical vapor deposition (LPCVD) techniques. The inline XPS monitors the stoichiometry of the film surface, while offline XPS is used to understand the entire thick film composition and Si/SiNx interface. For a complete compositional analysis, the XPS depth profile and detailed core-level spectra analysis are conducted for annealed and unannealed wafers. Finally, the XPS thickness is confirmed from cross-section images.

AIM Photonics (United States) (US)
AIM Photonics
Openalex Percentile: Top 89%
Electron and X-Ray Spectroscopy Techniques
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