Tool Matching and Process Optimization for Contact Metal CMP Contamination Reduction : CFM: Contamination-Free Manufacturing

Contamination from a Contact Metal CMP process leads to downstream embedded defects that lead to yield loss and Return Material Authorization (RMA’s) from customers due to fails during end use. This process has a unique cleaning methodology on both the polisher and cleaner side to minimize the formation of embedded defects that cause downstream metal interconnect shorts. Continuous improvements are needed to address the root cause of the failure and prevent defective product from being sent to the customer.