Predicting Seal Longevity: Advanced Simulations for Plasma and Rotary Applications in Semiconductor Processes : EO: Equipment Optimization
In many semiconductor manufacturing processes, ensuring vacuum integrity is critical to achieving optimal tool performance. Elastomers, particularly perfluoroelastomers (FFKMs), are widely employed in both static and dynamic sealing applications within high-end semiconductor equipment due to their resilience in harsh operating conditions such as chemical plasma. However, designing and optimizing each component of semiconductor equipment can be time-intensive, particularly when determining effective preventive maintenance (PM) cycles. The present contribution describes a finite element method to predict seal lifetime in two separate systems where material loss is a primary failure mode; abrasive wear of a rotary seal in a vacuum pump, and a static FFKM seal in a plasma etching application.
Authors
- Murat Gülçür (ORCID: https://orcid.org/0000-0003-0366-8201)
- J.-L. Paillard
- Feyzan Durn
- Thomas Dunn
- Alan Astbury
Institutions
- Trelleborg (Germany) (DE)
- Trelleborg (United Kingdom) (GB)
Publication Details
- Published
- 2025-05-05
- DOI
- https://doi.org/10.1109/asmc64512.2025.11010720
- Citations
- 2
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.85