Failure analysis of acceleration sensor with potting adhesive for EMU

The acceleration sensor for bogie frame monitoring is a very important product for EMU state monitoring. This paper studies the fault product of the transverse acceleration sensor with potting adhesive where the failure rate in recent three years is significantly higher than before, and improves the reliability based on the failure mechanism. Through the nondestructive testing methods X-ray(2D) and X-ray CT (3D) bubble scanning location failure and overall morphology structure and relative position distribution, combined with section optical analysis, the failure is the cause of SMT welding, material and force analysis of the main reason and aging test, and put forward prevention and improvement measures for quality improvement.