Investigating the Effect of Heat Sink Material on Processor Thermal Management
A heat sink functions as a passive cooling system, extracting heat from an electronic or mechanical device and transferring it to a fluid medium like air or liquid coolant. This process enables the regulation of the device's temperature to prevent overheating. The paper provides an overview of the current state of research on heat sink designs for processor cooling in laptops. The review discusses various materials for heat sink designs and their effectiveness in dissipating heat from electronic devices. There is a comparison between various materials other than aluminum and copper. Through that comparison, the paper determines the best alternative materials for aluminum and copper in a heat sink.
Authors
- Saurav Dixit (ORCID: https://orcid.org/0000-0002-6959-0008)
- Sanveda Gholap
- Laxmikant Mangate (ORCID: https://orcid.org/0000-0001-5527-2888)
- Siddhant Ghuge
- Akshay Kale
- Gagnesh S. Sawant
- Gayatri Hujare
- Abhishek Khairnar
Institutions
- International Institute of Information Technology (IN)
Publication Details
- Published
- 2025-05-15
- DOI
- https://doi.org/10.1109/iraset64571.2025.11008080
- Primary Topic
- Additive Manufacturing and 3D Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00