Numerical modeling of phase change materials

This paper presents the results of a comparison between a heat sink without phase change materials (PCM) and a heat sink with PCM, aiming to quantify the effect of the presence of PCM on the thermal management of electronic components. N-Eicosane with a melting temperature of 36.5 °C is used as the phase change material. These heat sinks generally require the use of techniques to improve heat transfer, due to the low thermal conductivity of phase change materials (PCM). An aluminum plate fin matrix is used in the present study to increase heat transfer. The performances of the heat sink matrix with and without PCM are compared. As a result, the material used in this simulation decreases the overheating effect of the heat sink (temperature pick without PCM 69 °C - temperature pick with PCM 61 °C).